our company specializes in the development and manufacture of soldering materials for the application of electronic joining. All of our products are made from high purity raw materials provided by domestic and foreign vendors. By using automatic machines, accurate inspection equipments, together with advanced technology and experienced engineers, all of the processes, including R&D, raw material inspection, producing are under strictly control in order to ensure the high quality of our products.

Our main Products:

Lead-free and Lead-contained solder paste, solder bar, solder wire and liquid flux

Layout:

Hong Kong company, Shen Zhen company, Dong Guan factory

Factory Outline:

Land area of 30000 square meters, producing ability of more than 5000 tons per year

Lead-free and Lead-contained workshops are totally separated

 R&D Center

Develop new products and apply for invention patent

Establish “Postgraduate Work Station” by the cooperation with Harbin Institute of Technology

Director of R&D center:

MA Xin, Ph.D., post-doctor of Hiroshima University, Japan, JSPS research fellow. He also serves as member of America Welding Society, Vice director of committee of “Brazing, soldering and special joining technology”, Director of sub-committee of “Lead-free Soldering technology”, China Welding Society.

Main achievement in the recent years：

（1）Sep. 2001, Establish “Soldering and Microjoining” R&D center

（2）Jan. 2002, Approved ISO 9001 international certification on quality management system (DNV)

（3）Mar. 2002, Development of lead-free series solder products

（4）Jan. 2003, Apply for China Patent on “Sn-Ag-Cu lead-free solder with high-oxidation property”, Apr. 2005, authorized the invention patent by State Intellectual Property Office of P.R.C (China Patent No. ZL 03 1 10895.4)

（5）Aug. 2003, Development of environmental-friendly, water-based, low-VOC flux WB200

（6）Aug. 2003, Authorized as one of the main members to draft the China National Standard on “Lead-free Solder” by Standardization Administration of China

（7）Apr. 2004, Authorized “Sublicense Agreement” for the US patent on “Sn-Ag-Cu lead-free solder” (US Patent No. 5527628)

（8）Oct. 2004, Begin to provide Pb-free solder wire for HAKKO, Japan, a famous soldering tool manufacturer all over the world

（9）Jan. 2005, Approved ISO 9001 international certification on quality management system and ISO 14001 international certification on environment management system (SGS)

（10）May 2005, Development of environmental-friendly cleaning agent: ECO CLEANER 100

Quality Management for Lead-free Solder Products

Using the Atomic Emission Spectrum (AES) equipment imported from Germany (Spectro Co.,), every batch of lead-free solder product will be carefully checked from the beginning mixing to the finished stage. For all of the lead-free solder products, we could ensure the Pb content is less than 1000ppm and the Cd content is less than 20ppm.

Further, all of our lead-free solder products have the inspection reports provided by the independent third-party inspector, SGS